EZ-MELT GRANULAR INGOT
The smallest, yet most versatile, member of our product line.
EZ-Melt Granular Ingot provides more surface area in a furnace that results in more efficient melting and reduced BTU consumption than traditional ingot.
START SMALL. MELT QUICKLY.
LABOR & PRODUCTIVITY:
- Labor saving
- Reduces pinch points vs traditional ingot
- Ideal form for charge automation
- Low dross
- No supplemental Phosphorous required
- Reduces melt time 10% or more
- Reduces BTU consumption
- Liquidus is only 1616 °F
- High strength
- High fluidity
- Low gassing
- NSF/ANSI/CAN 372 compliant
C87850 – ECO BRONZE has been recognized in a university study as the leading lead free alloy for environment friendliness, efficient manufacturing of component parts and end-of-life recyclability.
- High strength
- Dezincification resistant
- Corrosion resistant
- Good machinability
- Low pouring temperature
- High Fluidity
- Short solidification range
- Less prone to dispersed microporosity
- High detail replication
C87850 Copper Silicon Bronze Alloy Properties
|Melting Point – Liquidius (°F)||1616|
|Melting Point – Solidus (°F)||1571|
|Density (lb/cu in.)||0.3|
|Electrical Conductivity (%IACS at 68°F)||8|
|Thermal Conductivity (Btu/sq ft/ft hr/°F at 68°F)||21.8|
|Coefficient of Thermal Expansion (10-6per °F, 68-212°F)||10.3|
|Coefficient of Thermal Expansion (10-6 per °F, 68-392°F)||10.3|
|Coefficient of Thermal Expansion (10-6 per °F, 68-572°F)||10.4|
|Specific Heat Capacity (Btu/lb/°F at 68°F)||0.09|
|Annealing Temperature Range (°F)||1000-1200|
|Hot Working Temperature Range (°F)||1200-1400|
Chemistry Specification (ASTM B30)
|75-78%||2.7-3.4%||0.05-0.20%||0.09% max||0.10% max||0.30% max||0.20% max||0.10% max||0.10% max|
Minimum Mechanical Properties (ASTM B505, B584, B806)
|Casting Method||Tensile Strength (ksi)||Yield Strength (ksi)||Elong. %||
* This product complies with 0.25% weighted average lead content on wetted surfaces in accordance with Safe Drinking Water Act (SDWA) / Federal Public Law No. 111-380.
The values listed on this page represent reasonable approximations suitable for general engineering use. Due to commercial variations in compositions and to manufacturing limitations, they should not be used for specification purposes. See applicable ASTM international specification references.
** Laboratory testing shows that, when cleaned regularly, CuVerro surfaces kill greater than 99.9% of the following bacteria within 2 hours of exposure: Methicillin-Resistant Staphylococcus aureus, Staphylococcus aureus, Enterobacter aerogenes, Pseudomonas aeruginosa, and E. coli O157:H7. The use of CuVerro antimicrobial copper products is a supplement to and not a substitute for standard infection control practices; users must continue to follow all current infection control practices, including those practices related to cleaning and disinfection of environmental surfaces. This surface has been shown to reduce microbial contamination, but it does not necessarily prevent cross-contamination. It should not be interpreted that CuVerro® is making claims to solely prevent hospital-associated infections nor should it be implied that CuVerro products make such claims. CuVerro® is a registered trademark of GBC Metals, LLC and is used with permission. (C-0004-1303)
Wieland Chase is a leading brass manufacturer in North America. As of July 2019, Wieland Chase became part of the strong global Wieland Group with a continued commitment to safety, quality and customer service. More about the Wieland Group
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